A New Densification-Mechanism of Copper Powder Sintered under an Electrical Field
نویسندگان
چکیده
A new sintering mechanism is revealed for copper powder being sintered under the influence from electrical field and force-field during forming of micro-components. The analysis of the microstructure and grain boundary evolution on the sintered samples showed that interface disappearance at contact areas between particles is a continuous process which involves new grain formation and grain refinement during this innovative micro-sintering process. The densification process is therefore different from what is known in a conventional powder sintering process.
منابع مشابه
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